- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 35/08 - Structural details of the junction; Connections of leads non-detachable, e.g. cemented, sintered, soldered
Patent holdings for IPC class H01L 35/08
Total number of patents in this class: 296
10-year publication summary
|
22
|
33
|
34
|
41
|
46
|
42
|
34
|
16
|
3
|
1
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Kelk Ltd. | 147 |
18 |
| Panasonic Intellectual Property Management Co., Ltd. | 27812 |
17 |
| Mitsubishi Materials Corporation | 2378 |
17 |
| Valeo Systemes Thermiques | 2471 |
12 |
| Lintec Corporation | 1915 |
10 |
| LG Innotek Co., Ltd. | 6758 |
8 |
| LG Chem, Ltd. | 17205 |
7 |
| Hyundai Motor Company | 19021 |
6 |
| Sumitomo Chemical Company, Limited | 8808 |
6 |
| Kia Motors Corporation | 7946 |
6 |
| BASF SE | 19740 |
5 |
| Hitachi Chemical Company, Ltd. | 2455 |
5 |
| FUJIFILM Corporation | 27102 |
5 |
| Sheetak, Inc. | 45 |
5 |
| Nimbus Materials Inc | 7 |
5 |
| Denso Corporation | 23338 |
4 |
| Industrial Technology Research Institute | 4898 |
4 |
| MAHLE International GmbH | 2670 |
4 |
| Furukawa Co., Ltd. | 86 |
4 |
| Sumitomo Electric Industries, Ltd. | 14131 |
3 |
| Other owners | 145 |